The new arm will focus on three areas: packaging intelligence, supply chain optimisation and next-generation materials.

Advanced Packaging Has Become the Bottleneck Intel (INTC) is attempting to reposition itself in the semiconductor value chain ...

Fibre-based packaging, including moulded pulp and paper structures, is emerging as a scalable plastic alternative as ...

The Global Banking & Finance Review Awards programme has officially opened nominations for Fastest Growing Packaging ...

Atlantic Packaging, the largest privately held industrial packaging company in North America, has launched New Earth Ventures ("NEV"), a dedicated innovation and investment arm focused on building the ...

Secondary packaging is increasingly becoming a darling of companies’ smart technologies and sustainability goals.

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...

SK hynix has just announced it signed a memorandum of understanding with TSMC for collaboration to make next-generation HBM memory and enhance logic and HBM integration through advanced packaging ...

Packaging is more than a product vessel. It serves as a strategic tool for storytelling, trust-building, and delivering immersive brand experiences. Retailers and brands that leverage packaging as a ...

Explore packaging careers at Interpack 2026 with tours, forums, and hands-on demos for students and young professionals ...